main menu




Bonding is the electrical connecting of two or more conducting objects not otherwise adequately connected.

The following bonding requirements must be considered:

Equipment bonding :

low-impedance paths to aircraft structure are normally required for electronic equipment to provide radio frequency return circuits and for most electrical equipment to facilitate a reduction in EMI. The cases of components that produce electromagnetic energy should be grounded to the structure. To ensure proper operation of electronic equipment, it is particularly important to conform to the system’s installation specification when interconnections, bonding, and grounding is being accomplished.

Metallic surface bonding :

all conducting objects on the exterior of the airframe must be electrically connected to the airframe through mechanical joints, conductive hinges, or bond straps capable of conducting static charges and lightning strikes. Exceptions may be necessary for some objects, such as antenna elements, whose function requires them to be electrically isolated from the airframe. Such items should be provided with an alternative means to conduct static charges and/or lightning currents, as appropriate.

Static bonds:

all isolated conducting parts inside and outside the aircraft, having an area greater than 3 square inches and a linear dimension over 3 inches, that are subjected to appreciable electrostatic charging due to precipitation, fluid, or air in motion, should have a mechanically secure electrical connection to the aircraft structure of sufficient conductivity to dissipate possible static charges. A resistance of less than 1 ohm when clean and dry generally ensures such dissipation on larger objects. Higher resistances are permissible in connecting smaller objects to airframe structure.

reactions :